Today we continue our series on learning about the semiconductor industry. We are using the book, Understanding Semiconductors: A Technical Guide For Non-Technical People” by Corey Richard to guide our studies. We will go through some of the terms in Chapter 5 today.
If you are unfamiliar with the semiconductor industry, I recommend starting from the first post in this series. Some terms mentioned in Chapter 5 were covered in those posts.
Disclaimer: The videos below do not belong to us. The creators are mentioned in each video.
Interconnect: The method used to connect different components in a computer system.
Examples of different bonding techniques
Wafer Level Packaging: When the packaging process occurs before the wafer is cut. This procedure is used when creating chips for small devices such as cell phones and cameras.
System in Package: When multiple chips are placed in the same package. The chips are placed next to each other and on top of each other.
2.5D Integrated Circuit Packaging: When the chips are placed next to each other within the package.
3D Integrated Circuit Packaging: When the chips are stacked on top of each other within the package.
CONCLUSION
Next week we will continue with more of chapter 5.
Stay strong, stay blessed, and God willing, I will see you next week.
Who will protect me from the wicked? Who will stand up for me against evildoers? Unless the Lord had helped me, I would soon have settled in the silence of the grave. I cried out, “I am slipping!” but your unfailing love, O Lord, supported me.
Psalms 94:16-18 NLT
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